Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: Combining antenna arrays with physical reconfigurability (i.e., origami) allows for additional degrees of freedom in operation and enables larger structures to be folded into smaller volumes ...
If you’ve nothing better to do in the run-up to Christmas, then how about enjoying a mesmerizing hour-long video of a humanoid robot sorting packages? The clip was posted by the founder and CEO of ...
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