Abstract: In this invited paper, we demonstrate that the contact interface resistance is a major bottleneck for advanced FinFET performance scaling (38% of the external resistance at 45nm gate pitch).
Abstract: A 3-D-printed lightweight miniaturized dual-band dual-polarized feed module of wireless backhaul systems consisting of a dual-band air-filled waveguide orthomode transducer (OMT) and a ...
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