Gravel grid systems can be great, but they can equally cause issues and it's all dependent on where you want to install them, the materials you use, and more.
The flexible display's substrate is critical to e-paper's and e-ink's development. Many different types of materials are under investigation, including glass, plastic, polymer films, and metallic ...
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...
In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...
Multimaterial molding is supposed to take advantage of the efficiencies in forming two different materials into a single molded part. However, one firm’s planned production of a thermocontroller got ...