TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the invisible brain behind every intelligent system. As ...

TAIPEI (Taiwan News) — Cheng Mei Materials Technology Chair Sung Yen-i (宋妍儀) said the company is undergoing a transformation ...

V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging demand. The company ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

ALAB and KLAC benefit from AI-driven chip demand, but KLAC's process control strength and packaging momentum give it greater upside potential.