Combine scalable analytics with advanced AI capabilities like LLMs and agentic tasks to create a new chipmaking platform.

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level interconnects and 3D transistor designs means that many killer defects are no ...

Within the meticulous and layered journey of manufacturing semiconductor wafers, which could encapsulate anywhere from hundreds to thousands of steps over one to two months, even a minor defect or ...