KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

FCI extends its reflow process-compatible D-Sub family of connectors by introducing a new right-angle version for Pin-In-Paste (through-hole) technology. This product line extension will allow ...

This video describes Digicom’s solder reflow services. The advanced high-throughput convection reflow oven from Digicom produces customized time-temperature profiles for each board. A gold super-mold ...

The overall concept of reflow soldering is simple: put a pre-assembled board with some solder paste into an oven and bake it until the solder properly melts. When a board is reflowed, it typically is ...

Discrete electronic components such as resistors, capacitors and even larger IC's are shrinking down smaller every year, and that makes it harder for the average home maker or hobbyist to create their ...

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

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