Photon Design has announced that its FIMMWAVE photonic simulation software played a key role in enabling Photonect's development of an epoxy-free, fibre-to-chip optical interconnect technology ...
Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has ...
As AR glasses struggle with heat and battery limits, China's Appotronics is using LCoS architecture to improve brightness ...
A technical paper titled “Unlocking the monolithic integration scenario: optical coupling between GaSb diode lasers epitaxially grown on patterned Si substrates and passive SiN waveguides” was ...
In recent decades, augmented reality (AR) has evolved from a futuristic concept to a tangible and pervasive technology. AR enhances our perception and interaction with the environment by seamlessly ...
The newly introduced F50Se module delivers performance advantages through material innovation and upgraded fabrication processes. The FoV of AR display is fundamentally limited by the refractive index ...
The technology of integrated photonic quantum chips has successfully enabled the on-chip preparation, manipulation, and detection of photonic quantum states, thereby significantly accelerating the ...
Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...
Why co-packaged optics (CPO) are needed in high-performance computing (HPC). How IBM delivers CPO. What CPO means for HPC applications like artificial intelligence and machine learning. Providing high ...
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