Kyocera America, Inc. announced on F3b. 7 that it has doubled its flip-chip assembly capacity for microelectronic devices with a new $3.5 million Class 10,000 clean room, offering lead-free processes ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to Apple supply chain analyst Ming-Chi Kuo. This change has been rumored by ...
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