Apple unveils M5 Pro and M5 Max chips with new ‘Fusion Architecture’

The chips are engineered around Apple's new Fusion Architecture, an advanced design that merges two dies into a single, ...
MacSources

Apple debuts M5 Pro and M5 Max to supercharge the most demanding pro workflows

Apple today announced M5 Pro and M5 Max, the world’s most advanced chips for pro laptops, powering the new MacBook Pro. The ...

How M5 Pro and M5 Max push MacBook Pro into high-bandwidth AI era

On Tuesday, Apple introduced M5 Pro and M5 Max, debuting a dual-die Fusion Architecture that pushes Apple Silicon further ...
Cloud Computing

Montage Technology launches Memory eXpander Controller

Integrated circuit company Montage Technology has launched its CXL 3.1 Memory eXpander Controller (MXC), which is currently being tested by some of its key customers, including AMD and Intel. The ...
Nasdaq

Marvell Introduces Breakthrough Structera CXL Product Line to Address Server Memory Bandwidth and Capacity Challenges in Cloud Data Centers

New product line is the industry's first to integrate Arm® Neoverse® processors, inline compression, and four memory channels. Structera™ A CXL near-memory accelerator family is optimized to address ...
Semiconductor Engineering

HBM3E Memory: Break Through to Greater Bandwidth

Delivering unrivaled memory bandwidth in a compact, high-capacity footprint, has made HBM the memory of choice for AI training. HBM3 is the third major generation of the HBM standard, with HBM3E ...