JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Memory limitations have blindsided many cloud users. It’s crucial for enterprises to expand their focus beyond GPUs and for providers to fix memory problems to keep AI performance on track. Most of us ...

As high-performance computing (HPC) workloads become increasingly complex, generative artificial intelligence (AI) is being progressively integrated into modern systems, thereby driving the demand for ...

So I was reading some articles on the new Trinity from AMD and for giggles ran some Sandra on my box (1090T, DDR3-1600, 990FX chipset, 4x4GB DDR3) and was severely disappointed. According to Sandra, I ...

In context: The first iteration of high-bandwidth memory (HBM) was somewhat limited, only allowing speeds of up to 128 GB/s per stack. However, there was one major caveat: graphics cards that used ...

Agilex 7 FPGA M-Series Optimized to Reduce Memory Bottlenecks in AI and Data-intensive Applications SAN JOSE, Calif.--(BUSINESS WIRE)-- Altera Corporation, a leader in FPGA innovations, today ...