Amorphous oxide semiconductors like IGZO (indium gallium zinc oxide) offer acceptable carrier mobility with very low leakage. Amorphous oxides are especially attractive for stacked devices because ...

Laser Photonics Corporation (LPC) announced its attendance at the International Electron Devices Meeting (IEDM) 2024 to showcase advanced laser systems tailored for the semiconductor industry. IEDM ...

IBM is partially-filling through-silicon vias (TSVs) to side-step potential stress problems created when TSVs are completely filled with copper. TSVs are a key technology for stacking chips directly ...

Forbes contributors publish independent expert analyses and insights. I am an industry analyst covering the semiconductor market IEDM, the International Electron Device Meeting, presents advances in ...

It has taken longer than expected, but three years after Intel unveiled its 14nm technology at IEDM and nearly one year after it demonstrated a Cannon Lake laptop at CES, the company is finally ready ...