The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Teradyne rides on a 45% semiconductor test revenue surge fueled by AI compute, with 2026 growth tied closely to booming AI ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...

Keysight Technologies has introduced a set of validation solutions to help operators manage bandwidth limits, latency issues, ...

Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen the company's ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Micron said on Wednesday that it plans to stop selling memory to consumers to focus on providing enough memory for high-powered AI chips. "Micron has made the difficult decision to exit the Crucial ...

AMD’s Fuji was one of the first GPUs to use JEDEC’s High Bandwidth Memory (HBM) DRAM standard and now JEDEC has released an update which should attract others. JEDEC has announced an update to ...