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SK Hynix's $13B packaging facility promises more HBM for the AI bubble
Great news for AMD and Nvidia, less so for cash-strapped consumers Memory makers just can't churn out their DRAM fast enough.
The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...
New AI memory method lets models think harder while avoiding costly high-bandwidth memory, which is the major driver for DRAM ...
Micron's latest upsurge reflects that AI-driven upside extends beyond HBM, as accelerating DRAM and NAND pricing, reinforced ...
SK Hynix Inc. plans to spend 19 trillion won ($12.9 billion) building a new advanced chip packaging facility, kicking off a ...
AI is driving demand and higher prices for DRAM and NAND into 2026. Products using non-volatile memories to replace NOR and SRAM in embedded applications are growing.
AMD gains AI chip momentum with high-bandwidth memory, accelerating revenue, 30%+ data center growth, and a 1.2 PEG for ...
Cantor Fitzgerald raises Micron price target to $450 on cost reductions and HBM demand. Revenue climbs 56% with operating ...
Micron stock gets $450 price target from Cantor Fitzgerald on cost improvements and HBM demand. Revenue jumps 56% ...
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