Qualcomm announced two chips today (Dec 11) for the mid-range and entry-level markets: the Snapdragon 6s 4G Gen 2 and the Snapdragon 4 Gen 4. The 6s 4G Gen 2 utilizes the Kryo CPU cores for speeds of ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Why AI needs high-speed interconnects. How multichannel fiber meets AI demands. How multichannel fiber support fits on a chip. Though copper provides high-speed connectivity, it has limitations. One ...
Details behind Empower's new funding. The shift from board-level to chip-level voltage regulation. Commercial buy-in for voltage regulator ICs. Power startup Empower Semiconductor said it raised more ...
The PivotPoint FM1010 high-performance switch chip for board-level system interconnect can deliver 192 Gbits/s of sustained throughput using six SPI 4 phase 2 interfaces. PivotPoint replaces discrete ...
MediaTek’s Kompanio 520 processor has been powering entry-level Chromebooks since it was first introduced nearly three years ago. But now MediaTek has introduced a next-gen processor for low-cost ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results