Tom's Hardware on MSN

JEDEC releases new SPHBM4 standard to slash AI memory costs

Cheaper HBM-class memory.
Electronic Design

UMI Scales the Memory Wall in the Chiplet/Multi-Die Era

What are the current challenges involved with incorporating sufficient HBM into multi-die design? How a new interconnect technology can address the performance, size, and power issues that could ...
Semiconductor Engineering

Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)

“The rapid growth of LLMs has revolutionized natural language processing and AI analysis, but their increasing size and memory demands present significant challenges. A common solution is to spill ...